Datasheet HMC8400 (Analog Devices) - 7

Data Sheet HMC8400 TYPICAL PERFORMANCE CHARACTERISTICS 20 16 15 10 14 S11 5 S21 ) S22 B 0 12 B) SE (d d +85°C N –5 N ( +25°C AI –55°C –10 G 10 ESPO R –15 –20 8 –25 –30 6 0 4 8 12 16 20 24 28 32 36
006
2 6 10 14 18 22 26 30
007
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 8. Response Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C –5 +25°C +25°C –55°C –5 –55°C B) –10 B) d d ( ( S –10 S S S O O –15 URN L URN L –15 T T –20 RE RE –20 –25 –30 –25 2 6 10 14 18 22 26 30
008
2 6 10 14 18 22 26 30
009
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
5 18 +85°C 17 +25°C +85°C –55°C +25°C 4 –55°C 16 ) 15 dB ( 3 E 14 R Bm) d 13 B ( FIGU E 1d 2 P 12 OIS N 11 1 10 9 0 8
1 1
2 4 6 8 10 12 14 16 18 20 22 24 26 28
010
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
0
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. P1dB vs. Frequency at Various Temperatures Rev. B | Page 7 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE