Data SheetADL5726PIN CONFIGURATION AND FUNCTION DESCRIPTIONSVCC1 18 VCC2GND 27 OUTNADL5726INPT 3TOP VIEW6 OUTP(Not to Scale)RBIAS 45 DNCNOTES1. DNC = DO NOT CONNECT. DO NOTCONNECT TO THIS PIN.2. THE EXPOSED PAD MUST BESOLDERED TO A LOW IMPEDANCEGROUND PLANE.3. THE DEVICE NUMBER ON THE FIGURE 2 DOES NOT INDICATE THE LABEL ON 00 THE PACKAGE. REFER TO THE PIN 1 20- 43 INDICATOR FOR THE PIN LOCATIONS. 1 Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No.MnemonicDescription 1 VCC1 1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. 2 GND Ground. 3 INPT RF Input. This is a 50 Ω single-ended input. 4 RBIAS Resistor Bias. For typical operation, connect a 442 Ω resistor from RBIAS to GND. It is recommended to place the RBIAS resistor as close to the pin as possible. 5 DNC Do Not Connect. Do not connect to this pin. 6, 7 OUTP, OUTN RF Outputs. These pins are 100 Ω differential outputs. 8 VCC2 3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. EPAD (EP) Exposed Pad. The exposed pad must be soldered to a low impedance ground plane. Rev. A | Page 5 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS AC SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION LAYOUT DIFFERENTIAL vs. SINGLE-ENDED OUTPUT PERFORMANCE UP TO 26.5 GHz EVALUATION BOARD INITIAL SETUP RESULTS BASIC CONNECTIONS FOR OPERATION OUTLINE DIMENSIONS ORDERING GUIDE
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