ADL5723Data SheetABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 3. θ Parameter Rating JA is thermal resistance, junction to ambient (°C/W), θJB is thermal resistance, junction to board (°C/W), and θ Supply Voltages JC is thermal resistance, junction to case (°C/W). VCC1 2.25 V VCC2 4.1 V Table 4. Thermal Resistance Maximum Junction Temperature 150°C/W Package Typeθ 111JAθJBθJC Unit Operating Temperature Range −40°C to +85°C 8-Lead LFCSP 39.90 23.88 3.71 °C/W Storage Temperature Range −55°C to +125°C 1 Lead Temperature Range (Soldering 60 sec) −65°C to +150°C See JEDEC standard JESD51-2 for additional information on optimizing the thermal impedance for a printed circuit board (PCB) with 3 × 4 vias. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a ESD CAUTION stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AC SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION LAYOUT DIFFERENTIAL vs. SINGLE-ENDED OUTPUT EVALUATION BOARD INITIAL SETUP RESULTS BASIC CONNECTIONS FOR OPERATION OUTLINE DIMENSIONS ORDERING GUIDE
