Datasheet HMC1049 (Analog Devices) - 7

Data Sheet HMC1049 TYPICAL PERFORMANCE CHARACTERISTICS
Data taken with VDD applied to Pad 2, with VDD = 7 V.
25 0 S21 TA = +85°C S11 TA = +25°C S22 TA = –55°C 15 –5 ) 5 B) –10 B d ( S S SE (d O N –5 –15 URN L ESPO T R –15 –20 RE –25 –25 –35 –30 0 4 8 12 16 20 24
012
0 2 4 6 8 10 12 14 16 18 20 22
015
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 10. Broadband, Gain, and Return Loss Figure 13. Output Return Loss vs. Temperature
20 5 TA = +85°C TA = +85°C TA = +25°C TA = +25°C 18 TA = –55°C TA = –55°C 4 16 ) dB ( 3 B) 14 E d R N ( AI 12 FIGU G E 2 OIS N 10 1 8 6 0 0 2 4 6 8 10 12 14 16 18 20 22
013
0 2 4 6 8 10 12 14 16 18 20 22
016
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 11. Gain vs. Temperature Figure 14. Noise Figure vs. Temperature
0 5 TA = +85°C 6V TA = +25°C 7V TA = –55°C 8V –5 4 ) B) –10 d dB ( ( S 3 E S R O –15 FIGU URN L E 2 T –20 OIS RE N 1 –25 –30 0 0 2 4 6 8 10 12 14 16 18 20 22
014
0 2 4 6 8 10 12 14 16 18 20 22
017
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 12. Input Return Loss vs. Temperature Figure 15. Noise Figure vs. VDD Rev. B | Page 7 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings ESD Caution PIN Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Application Circuit Assembly Diagram Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide