Data SheetHMC1040CHIPSSPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE TA = 25°C, supply voltage (VDD) = 2.5 V, and supply current (IDQ) = 65 mA, unless otherwise noted. Table 1. ParameterSymbolMinTypMaxUnit FREQUENCY RANGE 20 24 GHz GAIN 24.5 dB Gain Variation Over Temperature 0.018 dB/°C NOISE FIGURE NF 4 dB RETURN LOSS Input 18 dB Output 18 dB OUTPUT Output Power for 1 dB Compression P1dB 12.5 dBm Saturated Output Power PSAT 13.5 dBm Output Third-Order Intercept IP3 21 dBm SUPPLY Current IDQ 65 mA Voltage VDD 2 2.5 3.5 V 24 GHz TO 32 GHz FREQUENCY RANGE TA = 25°C, VDD = 2.5 V, and IDQ = 65 mA, unless otherwise noted. Table 2. ParameterSymbolMinTypMaxUnit FREQUENCY RANGE 24 32 GHz GAIN 23 25.0 dB Gain Variation Over Temperature 0.021 dB/°C NOISE FIGURE NF 2.5 2.7 dB RETURN LOSS Input 13 dB Output 13 dB OUTPUT Output Power for 1 dB Compression P1dB 13.5 dBm Saturated Output Power PSAT 14.5 dBm Output Third-Order Intercept IP3 22.5 dBm SUPPLY Current IDQ 65 mA Voltage VDD 2 2.5 3.5 V Rev. 0 | Page 3 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
