HMC1040CHIPSData Sheet32 GHz TO 40 GHz FREQUENCY RANGE TA = 25°C, VDD = 2.5 V, and IDQ = 65 mA, unless otherwise noted. Table 3. ParameterSymbolMinTypMaxUnit FREQUENCY RANGE 32 40 GHz GAIN 21 23 dB Gain Variation Over Temperature 0.021 dB/°C NOISE FIGURE NF 2 2.7 dB RETURN LOSS Input 11 dB Output 13 dB OUTPUT Output Power for 1 dB Compression P1dB 13.5 dBm Saturated Output Power PSAT 15.5 dBm Output Third-Order Intercept IP3 24.5 dBm SUPPLY Current IDQ 65 mA Voltage VDD 2 2.5 3.5 V 40 GHz TO 44 GHz FREQUENCY RANGE TA = 25°C, VDD = 2.5 V, and IDQ = 65 mA, unless otherwise noted. Table 4. ParameterSymbolMinTypMaxUnit FREQUENCY RANGE 40 44 GHz GAIN 19 21 dB Gain Variation Over Temperature 0.023 dB/°C NOISE FIGURE NF 2.5 3.2 dB RETURN LOSS Input 6 dB Output 13 dB OUTPUT Output Power for 1 dB Compression P1dB 14 dBm Saturated Output Power PSAT 16 dBm Output Third-Order Intercept IP3 25.5 dBm SUPPLY Current IDQ 65 mA Voltage VDD 2 2.5 3.5 V Rev. 0 | Page 4 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
