Data SheetHMC1040CHIPSABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 5. ParameterRating Thermal performance is directly linked to system design and Drain Bias Voltage (V operating environment. DD) 4 V dc Radio Frequency (RF) Input Power (RFIN) 5 dBm Careful attention to PCB thermal design is required. Continuous Power Dissipation (PDISS), 0.49 W θJC is the channel to case thermal resistance, channel to bottom T = 85°C (Derate 5.46 mW/°C Above 85°C) of die. Channel Temperature 175°C Storage Temperature Range −65°C to +150°C Table 6. Thermal Resistance Operating Temperature Range −55°C to +85°C Package TypeθJCUnit Electrostatic Discharge (ESD) Sensitivity C-5-6 183 °C/W Human Body Model (HBM) Class 0 passed, 100 V Stresses at or above those listed under Absolute Maximum ESD CAUTION Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
