link to page 6 link to page 6 link to page 6 link to page 6 HMC1040CHIPSData SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSHMC1040CHIPS234VDD1VDD2VDD31RFINRFOUT 5 002 16709- Figure 2. Pad Configuration Table 7. Pad Function Descriptions Pad No.MnemonicDescription 1 RFIN Radio Frequency Input. This pad ac couples the RF signal, has a 5 kΩ resistor connected to GND, and is matched to 50 Ω. See Figure 3 for the interface schematic. 2, 3, 4 VDD1, VDD2, VDD3 Power Supply Voltages for the Amplifier. Connect a dc bias to provide drain current (IDD). See Figure 4 for the interface schematic. 5 RFOUT RF Output. This pad ac couples the RF signal, has a 5 kΩ resistor connected to GND, and is matched to 50 Ω. See Figure 5 for the interface schematic. Die Bottom GND Ground. Die bottom must be connected to RF/dc ground. See Figure 6 for the interface schematic. INTERFACE SCHEMATICSRFOUTRFIN5kΩ 005 5kΩ 003 16709- 16709- Figure 3. RFIN Interface Schematic Figure 5. RFOUT Interface Schematic VDD1, VDD2, VDD3GND 006 004 16709- 16709- Figure 4. VDD1, VDD2, VDD3, Interface Schematic Figure 6. GND Interface Schematic Rev. 0 | Page 6 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
