Datasheet HMC903 (Analog Devices) - 5

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Data Sheet HMC903 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 2 3 VDD1 VDD2 HMC903 1 RFIN RFOUT 4 V V GG1 GG2 6 5
002 14481- Figure 2. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN Radio Frequency Input. This pad is matched to 50 Ω. See Figure 3 for the interface schematic. 2, 3 VDD1, VDD2 Power Supply Voltages. Power supply voltage for the amplifier. See Figure 24 and Figure 25 for required external components. See Figure 4 for the interface schematic. 4 RFOUT Radio Frequency Output. This pad is matched to 50 Ω. See Figure 5 for the interface schematic. 5, 6 VGG2, VGG1 Gate Control Voltages. Optional gate control for amplifier. When left open, the amplifier is self biased. Applying a negative voltage reduces the current. See Figure 6 for the interface schematic. Die Bottom GND Ground. Die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic.
INTERFACE SCHEMATICS RFIN
003
ESD
14481- 006
VGG1, VGG2
14481- Figure 3. RFIN Interface Schematic Figure 6. VGG1, VGG2 Interface Schematic
V GND DD1, VDD2
007 004 14481- 14481- Figure 4. VDD1, VDD2 Interface Schematic Figure 7. GND Interface Schematic
RFOUT
005
ESD
14481- Figure 5. RFOUT Interface Schematic Rev. C | Page 5 of 13 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE