Datasheet HMC902 (Analog Devices) - 7

Data Sheet HMC902 25 24 +85°C +25°C –55°C 20 20 (%) AE 16 , P 15 dB) 12 dBm) N ( B ( AI , G 8 P1d 10 (dBm) 4 UT 5 P O 0 POUT GAIN PAE 0 –4 4 5 6 7 8 9 10 11
014
–21 –18 –15 –12 –9 –6 –3 0 3
017
FREQUENCY (GHz)
14525-
INPUT POWER (dBm)
14525- Figure 14. P1dB vs. Frequency at Various Temperatures Figure 17. POUT, Gain, and Power Added Efficiency (PAE) vs. Input Power at 7 GHz
0 22 7 +85°C +25°C –55°C –10 20 6 B) 18 5 ) N (d –20 dBm) B ( 16 4 RE (dB LATIO 1d SO –30 , P 14 3 E FIGU SE I dB) N ( –40 AI NOIS G 12 2 REVER –50 10 P1dB 1 GAIN NOISE FIGURE –60 8 0 4 5 6 7 8 9 10 11
015
3.0 3.5 4.0
018
FREQUENCY (GHz) V
14525-
DD (V)
14525- Figure 15. Reverse Isolation vs. Frequency at Various Temperatures Figure 18. Gain, P1dB, and Noise Figure vs. Supply Voltage (VDD) at 7 GHz
25 +85°C +25°C –55°C 20 15 (dBm) P SAT 10 5 0 5 6 7 8 9 10 11
016
FREQUENCY (GHz)
14525- Figure 16. PSAT vs. Frequency at Various Temperatures Rev. D | Page 7 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE