link to page 10 link to page 10 link to page 11 link to page 11 Data SheetHMC753PIN CONFIGURATION AND FUNCTION DESCRIPTIONSDDCCCCGNNINININIGN432109222221GND 118 GNDGND 217 GNDRFIN 3HMC75316 RFOUTTOP VIEWGND 415 GND(Not to Scale)GND 514 GNDGND 613 GND789012111D21CDDDNIGNGGGGVVVGNNOTES 1. NIC = NOT INTERNALLY CONNECTED. THESE PINSARE NOT INTERNALLY CONNECTED; HOWEVER, ALL DATA SHOWN IS MEASURED WITH THESE PINS CONNECTED EXTERNALLY TO RF/DC GROUND. -002 2. EXPOSED PAD. THE EXPOSED PAD MUST BE 94 CONNECTED TO RF/DC GROUND. 134 Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No.MnemonicDescription 1, 2, 4 to 7, 12 to 15, 17 GND Ground. The package bottom has an exposed metal pad that must be connected to RF/dc to 19, 24 ground. 3 RFIN RF Input. This pad is ac-coupled and matched to 50 Ω. 8, 9 VGG2, VGG1 Gate Control for the Amplifier. Follow the biasing procedures described in the Biasing Procedure section. See Figure 23 for required external components. 10 VDD Power Supply Voltage for the Amplifier. See Figure 23 for required external components. 11, 20 to 23 NC Not Internally Connected. These pins are not internally connected; however, all data shown is measured with these pins connected externally to RF/dc ground. 16 RFOUT RF Output. This pad is ac-coupled and matched to 50 Ω. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground. Rev. E | Page 5 of 13 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Evaluation PCB Outline Dimensions Ordering Guide
