Datasheet HMC-AUH312 (Analog Devices) - 6

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HMC-AUH312 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 2 VGG1 1 RFIN/VGG1 HMC-AUH312 TOP VIEW (Not to Scale) RFOUT/VDD 3 V V DD GG2 5 4
002
NOTES
76-
1. DIE BOTTOM MUST BE CONNECTED TO RF/DC GROUND.
134 Figure 2. Pin Configuration
Table 6. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN/VGG1 RF Input/Gate Bias for Alternate Circuit for the Input Stage. This is a multifunction pin where the VGG1 function is used in the alternate circuit only for biasing (see Figure 23 and Figure 25 for the alternate applications circuit and alternate assembly drawings, respectively). This pin is dc-coupled and requires a dc block. See Figure 3 for the interface schematic. 2, 4 VGG1, VGG2 Gate Control for Amplifier. For more information about assembly and required assembly components, see Figure 24. See Figure 4 for the interface schematic. 3 RFOUT/VDD RF Output/DC Bias for Alternate Application Circuit for the Output Stage. This is a multifunction pin where the VDD function is used in the alternate application circuit only for biasing (see Figure 23 and Figure 25 for the alternate applications circuit and alternate assembly diagram, respectively). This pin is dc-coupled and requires a dc block. See Figure 5 for the interface schematic. 5 VDD Supply Voltage for Application Circuit. See Figure 22 and Figure 24 for the external components. See Figure 6 for the interface schematic. GND Die Bottom (Ground). The die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic. Rev. F | Page 6 of 17 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications 0.5 GHz to 60 GHz Frequency Range 60 GHz to 80 GHz Frequency Range Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Applications Overview Device Mounting Device Operation Device Power-Up Instructions Device Power-Down Instructions Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Guidelines for ESD Protection of GaAs MMICs Handling Precautions Opening the Protective Packaging Storage Cleanliness Static Sensitivity Transients General Handling Mounting Techniques Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide