Datasheet HMC-AUH312 (Analog Devices) - 8

HMC-AUH312 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 14 +85°C +25°C –55°C 10 12 ) 0 10 B B) d SE (d N –10 8 N ( AI G ESPO R –20 6 –30 S11 4 S21 S22 –40 2
1 1
0 10 20 30 40 50 60 70 80 90 100
008
0 10 20 30 40 50 60 70 80
0
FREQUENCY (GHz) FREQUENCY (GHz)
13476- 13476- Figure 8. Gain and Return Loss Figure 11. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C +25°C +25°C –55°C –5 –55°C –5 –10 B) –10 B) d d ( ( S S S –15 S O O –15 –20 URN L URN L T T –20 RE RE –25 –25 –30 –30 –35 0 10 20 30 40 50 60 70 80
009
0 10 20 30 40 50 60 70 80
012
FREQUENCY (GHz)
13476-
FREQUENCY (GHz)
13476- Figure 9. Input Return Loss at Various Temperatures Figure 12. Output Return Loss at Various Temperatures
18 18 +85°C +25°C –55°C 16 16 14 14 Bm) Bm) d d 12 ( 12 B ( AT 1d S P P 10 10 8 8 +85°C +25°C –55°C 6 6 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
010
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
013
FREQUENCY (GHz)
13476-
FREQUENCY (GHz)
13476- Figure 10. P1dB vs. Frequency at Various Temperatures Figure 13. PSAT vs. Frequency at Various Temperatures Rev. F | Page 8 of 9 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications 0.5 GHz to 60 GHz Frequency Range 60 GHz to 80 GHz Frequency Range Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Applications Overview Device Mounting Device Operation Device Power-Up Instructions Device Power-Down Instructions Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Guidelines for ESD Protection of GaAs MMICs Handling Precautions Opening the Protective Packaging Storage Cleanliness Static Sensitivity Transients General Handling Mounting Techniques Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide