HMC-ALH369 v06.0118 GaAs HEMT MMIC LOW NOISEAMPLIFIER, 24 - 40 GHzAbsolute Maximum Ratings Drain Bias Voltage +5.5 Vdc IP RF Input Power (24 - 32 GHz) 5 dBm ELECTROSTATIC SENSITIVE DEVICE H RF Input Power (32 - 40 GHz) -1 dBm OBSERVE HANDLING PRECAUTIONS Channel Temperature 180 °C C - Storage Temperature -65 to +150 °C S Operating Temperature -55 to +85 °C R IE LIF P M Outline Drawing A E IS O N W LO NOTES: Die Packaging Information [1] 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. Standard Alternate 3. BACKSIDE METALLIZATION: GOLD. GP-2 (Gel Pack) [2] 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. [1] Refer to the “Packaging Information” section for die packaging dimensions. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Analog 7. OVERALL DIE SIZE ±.002” Devices Corporation. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 3 Application Support: Phone: 1-800-ANALOG-D
