HMC463 v11.0617 GaAs PHEMT MMIC LOW NOISEAGC AMPLIFIER, 2 - 20 GHz 1 Outline Drawing IP H E - C IS O W N O S - L R IE LIF P M A Die Packaging Information [1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) GP-2 (Gel Pack) [2] 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 6. BACKSIDE METAL IS GROUND packaging dimensions. 7. BOND PAD METALIZATION: GOLD [2] For alternate packaging information contact Analog 8. OVERALL DIE SIZE ±.002” Devices, Inc. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 1 - 5 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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