Datasheet ADPA9002 (Analog Devices) - 5

Data Sheet ADPA9002 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board VDD 16 V (PCB) design and operating environment. Careful attention to VGG1 −2.5 V to +1 V PCB thermal design is required. θJC is the junction to case RFIN 25 dBm thermal resistance. Continuous Power Dissipation (PDISS), T = 85°C 10.2 W (Derate 113.64 mW/°C Above 85°C)
Table 5. Thermal Resistance
Output Load Voltage Standing Wave Ratio 7:1
Package θJC Unit
(VSWR) CG-32-2 8.8 °C/W Temperature Storage Range −65°C to +150°C
ESD CAUTION
Operating Range −40°C to +85°C Peak Reflow (Moisture Sensitivity Level 260°C (MSL) 3) Junction to Maintain 1 Million Hour Mean 175°C Time to Failure (MTTF) Nominal Junction (T = 85°C, V DD = 12 V) 125.7°C ESD Sensitivity Human Body Model (HBM) Class 1B, passed 500 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DC TO 2 GHz 2 GHz TO 5 GHz 5 GHz TO 10 GHz ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT OUTLINE DIMENSIONS ORDERING GUIDE