Datasheet HMC8205BCHIPS (Analog Devices) - 9

Data Sheet HMC8205BCHIPS 50 50 48 48 46 46 44 44 42 42 Bm) Bm) d d ( 40 ( 40 UT UT O O P 38 P 38 36 36 34 34 +85°C +85°C 32 +25°C 32 +25°C –55°C –55°C 30 30 0 1 2 3 4 5 6 7
020
0 1 2 3 4 5 6 7
022
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 21. POUT vs. Frequency at Various Temperatures, PIN = 24 dBm Figure 24. POUT vs. Frequency at Various Temperatures, PIN = 28 dBm
50 50 48 48 46 46 44 44 42 42 Bm) Bm) (d 40 (d 40 UT UT O O P 38 P 38 36 36 28V 34 28V 40V 34 40V 45V 45V 32 50V 32 50V 55V 55V 30 30 0 1 2 3 4 5 6 7
021
0 1 2 3 4 5 6 7
023
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 22. POUT vs. Frequency at Various Voltages, PIN = 24 dBm Figure 25. POUT vs. Frequency at Various Voltages, PIN = 28 dBm
50 50 48 48 46 46 44 44 42 42 Bm) Bm) (d 40 (d 40 UT UT O O P 38 P 38 36 36 34 34 1300mA 1300mA 32 900mA 32 900mA 500mA 500mA 30 30 0 1 2 3 4 5 6 7
024
0 1 2 3 4 5 6 7
025
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 23. POUT vs. Frequency at Various Quiescent Currents (IDD1 + IDD2), Figure 26. POUT vs. Frequency at Various Quiescent Currents (IDD1 + IDD2), PIN = 24 dBm PIN = 28 dBm Rev. A | Page 9 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE