Datasheet HMC8205BF10 (Analog Devices) - 9

Data Sheet HMC8205BF10 50 3000 30 45 2800 25 40 2600 %) ( AE 35 2400 , P 20 B) 30 2200 ) d m N ( B 25 2000 mA) AI ( (d 15 , G I DD IN 20 1800 A 22dBm G 24dBm Bm) d 10 26dBm ( 15 1600 28dBm UT 30dBm O 10 POUT 1400 P GAIN 5 5 PAE 1200 IDD 0 1000 0
041
10 12 14 16 18 20 22 24 26 28 30 0 1 2 3 4 5 6
044
INPUT POWER (dBm)
13790-
FREQUENCY (GHz)
13790- Figure 27. POUT, Gain, PAE, and IDD vs. Input Power at 6 GHz Figure 30. Gain vs. Frequency at Various Input Powers
65 50 60 48 55 46 50 45 44 Bm) d 40 22dBm 42 ) R ( 24dBm E 35 26dBm W 40 28dBm E (% O 30 30dBm P PA 25 UT 38 P 20 UT 36 O 15 +85°C 34 10 +25°C –40°C 32 5 0 30 0 1 2 3 4 5 6
042 043
0 1 2 3 4 5 6 FREQUENCY (GHz) FREQUENCY (GHz)
13790- 13790- Figure 28. PAE vs. Frequency at Various Temperatures at Figure 31. Output Power (POUT) vs. Frequency at Various Input Powers Input Power Set to 26 dBm
70 50 48 60 22dBm 46 24dBm Bm) d 50 26dBm ( 44 28dBm 30dBm INT O ) 42 40 N P E (% IO 40 S PA S 30 38 RE P M 20 36 +85°C B CO +25°C 34 4d –40°C 10 32 0 30 0 1 2 3 4 5 6
045 038
0 1 2 3 4 5 6 FREQUENCY (GHz) FREQUENCY (GHz)
13790- 13790- Figure 29. PAE vs. Frequency at Various Input Powers Figure 32. 4 dB Compression Point vs. Frequency at Various Temperatures Rev. C | Page 9 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Application Circuit Evaluation PCB Outline Dimensions Ordering Guide