Datasheet HMC1114PM5E (Analog Devices) - 5

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Data Sheet HMC1114PM5E ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board VDD 35 V (PCB) design and operating environment. Careful attention to VGG −8 V to 0 V dc PCB thermal design is required. Radio Frequency Input (RFIN) Power 30 dBm θJC is the junction to case thermal resistance. Maximum Voltage Standing Wave Ratio 6:1 (VSWR)1
Table 5. Thermal Resistance
Channel Temperature 225°C
Package Type θ 1 JC Unit
Maximum Peak Reflow Temperature 260°C CG-32-2 5.5 °C/W (Moisture Sensitivity Level 3 (MSL3))2 Continuous Power Dissipation, P 1 Thermal resistance (θJC) was determined by simulation under the following DISS (TA = 85°C, 25.5 W conditions: the heat transfer is due solely to thermal conduction from the Derate 182 mW/°C Above 85°C) channel, through the ground paddle, to the PCB, and the ground paddle is Storage Temperature Range −65°C to +150°C held constant at the operating temperature of 85°C. Operating Temperature Range −40°C to +85°C Electrostatic Discharge (ESD) Sensitivity
ESD CAUTION
Human Body Model (HBM) Class 1A, passed 250 V 1 Restricted by maximum power dissipation. 2 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 17 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS TOTAL SUPPLY CURRENT BY VDD ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCE During Power-Up During Power-Down TYPICAL APPLICATION CIRCUIT EVALUATION PCB OUTLINE DIMENSIONS ORDERING GUIDE