link to page 6 link to page 6 link to page 18 Data SheetHMC1099PM5EABSOLUTE MAXIMUM RATINGS Table 5.THERMAL RESISTANCEParameter1Rating Thermal performance is directly linked to printed circuit board Supply Voltage (VDD) 32 V (PCB) design and operating environment. Careful attention to Gate Bias Voltage (VGG) −8 V to 0 V PCB thermal design is required. Radio Frequency Input Power (RFIN) 33 dBm θJC is the junction to case thermal resistance. Voltage Standing Wave Ratio (VSWR)2 6:1 Channel Temperature 225°C Table 6. Thermal Resistance Peak Reflow Temperature Moisture 260°C Package TypeθJCUnit Sensitivity Level 3 (MSL3)3 CG-32-21 6.6 °C/W Continuous Power Dissipation, PDISS (TA = 85°C, 21.21 W Derate 151.5 mW/°C Above 85°C) 1 Thermal resistance (θJC) was determined by simulation under the following Storage Temperature Range −65°C to +150°C conditions: the heat transfer is due solely to thermal conduction from the channel, through the ground paddle, to the PCB, and the ground paddle is Operating Temperature Range −40°C to +85°C held constant at the operating temperature of 85°C. Electrostatic Discharge (ESD) Sensitivity ESD CAUTION Human Body Model Class 1B, passed 500 V 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the absolute maximum rating is listed. For full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 Restricted by maximum power dissipation. 3 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 18 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Total Quiescent Current by VDD Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Evaluation PCB Outline Dimensions Ordering Guide
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