HMC1087F10 v04.1217 8 WATT Flange Mount GaN MMICPOWER AMPLIFIER, 2 - 20 GHzEvaluation PCB [1] T m s r - e w o p r & A e lin s - r ie lif p m Evaluation Order Information A item Contents part number evaluation pCB only HmC1087f10 evaluation pCB eVAl01-HmC1087f10 [2] [2] reference this number when ordering evaluation pCB only List of Materials for Evaluation PCB EVAL01-HMC1087F10 item Description The circuit board used in the application should use J2, J3 sri K Connector rf circuit design techniques. signal lines should J1 DC Connector have 50 ohm impedance while the package ground leads and exposed paddle should be connected J4, J5 preform jumpers directly to the ground plane similar to that shown. C1 - C6 1 uf Capacitor, 0602 pkg. A sufficient number of via holes should be used to C7 - C8 10 uf Capacitor, 1210 pkg. connect the top and bottom ground planes. The U1 HmC1087f10 evaluation circuit board shown is available from pCB [1] 600-00619-00 evaluation pCB. Analog Devices, upon request. [2] Circuit Board material: rogers 4350 or Arlon 25fr [1] The universal evaluation board shown above is designed to support multible products, please refer to Application Circuit herein for required external components. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 11 Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Power Compression @ 10 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit
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