Datasheet HMC6981LS6 (Analog Devices) - 5

HMC6981LS6
v03.1018
GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 15 - 20 GHz Power Compression @ 17.5 GHz Reverse Isolation vs. Temperature
40 3000 0 T Pout 2750 -10 35 ) Gain m % PAE -20 2500 s 30 ) +25 C B -30 +85 C , PAE( d 25 2250 ( -40 C B) Idd N (d -40 r - IO N 20 2000 ( T AI m e A -50 A L ) O ), G 15 1750 IS -60 w Bm 10 Idd 1500 o t(d -70 u p Po 5 1250 -80 -90 0 1000 15 16 17 18 19 20 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 r & FREQUENCY (GHz) INPUT POWER (dBm) A
Gain & Power vs. Gain & Power vs.
e
Supply Current @ 17.5 GHz Supply Voltage @ 17.5 GHz
40 40 lin ) m m (dB (dB s - at 35 at 35 s s r ), P ), P m m ie (dB 30 (dB 30 1dB 1dB lif ), P ), P p 25 (dB 25 GAIN (dB) (dB n GAIN (dB) m P1dB (dBm) n ai P1dB (dBm) ai G Psat (dBm) G Psat (dBm) A 20 20 800 900 1000 1100 1200 1300 1400 5 5.1 5.2 5.3 5.4 5.5 Idd (mA) Vdd (V)
Detector Voltage vs. Power Dissipation Temperature @ 17.5 GHz
12 10 15 GHz ) +25 C 16 GHz 1 +85 C (W 10 17 GHz N - 40 C 18 GHz IO 19 GHz (V) 0.1 PAT 20 GHz 8 ISSI D 0.01 Vref-Vdet ER W 6 PO 0.001 4 0.0001-20 -10 0 10 20 30 -5 -2 1 4 7 10 13 OUTPUT POWER (dBm) INPUT POWER (dBm) For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Power Compression @ 4 GHz Power Compression @ 10 GHz Power Compression @ 20 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Reverse Isolation vs Temperature Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit