Datasheet ADL6010 (Analog Devices) - 8

ADL6010 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS ADL6010 ADL6010 TOP VIEW (Not to Scale) RFCM 4 3 VPOS VPOS 3 RFIN 5 2 VOUT 6 COMM RFCM 1 VOUT 2 4 RFCM NOTES 1. EXPOSED PAD. THE EXPOSED PAD (EPAD) ON THE UNDERSIDE OF THE DEVICE IS ALSO INTERNALLY CONNECTED TO GROUND AND REQUIRES GOOD THERMAL 5 RFIN AND ELECTRICAL CONNECTION TO THE GROUND OF THE PRINTED CIRCUIT BOAR CONNECT ALL GROUND PINS TO A LOW IMPEDANCE GROUND PLANE TOGETHER WITH THE EPAD. 6 RFCM COMM 1
050
TOP VIEW (CIRCUIT SIDE) (Not to Scale)
11617- Figure 2. 6-Lead LFCSP Pin Configuration Figure 3. 6-Pad Bare Die Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic Description
1 COMM Device Ground. Connect COMM to the system ground using a low impedance ground plane together with the exposed pad (EPAD). 2 VOUT Output Voltage. The output from the VOUT pin is proportional to the envelope value at the RFIN pin. 3 VPOS Supply Voltage. The operational range is from 4.75 V to 5.25 V. Decouple the power supply using the suggested capacitor values of 100 pF and 0.1 µF and locate these capacitors as close as possible to the VPOS pin. 4, 6 RFCM Device Grounds. Connect the RFCM pins to the system ground using a low impedance ground plane together with the exposed pad (EPAD). 5 RFIN Signal Input. The RFIN pin is ac-coupled and has an RF input impedance of approximately 50 Ω. EPAD1 Exposed Pad. The exposed pad (EPAD) on the underside of the device is also internally connected to ground and requires good thermal and electrical connection to the ground of the printed circuit board (PCB). Connect all ground pins to a low impedance ground plane together with the EPAD. 1 Not applicable for the 6-pad bare die. Rev. E | Page 8 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS MEASUREMENT SETUPS THEORY OF OPERATION BASIC CONNECTIONS PCB LAYOUT RECOMMENDATIONS SYSTEM CALIBRATION AND ERROR CALCULATION EFFECT OF A CAPACITIVE LOAD ON RISE TIME AND FALL TIME EVALUATION BOARD EVALUATION BOARD ASSEMBLY DRAWINGS OUTLINE DIMENSIONS ORDERING GUIDE