Datasheet MBRD835L, SBRD8835L (ON Semiconductor)
Производитель | ON Semiconductor |
Описание | Schottky Barrier Rectifier, 35 V, 8.0 A |
Страниц / Страница | 7 / 1 — DPAK Surface Mount Package. www.onsemi.com. SCHOTTKY BARRIER. Features. … |
Версия | 13 |
Формат / Размер файла | PDF / 180 Кб |
Язык документа | английский |
DPAK Surface Mount Package. www.onsemi.com. SCHOTTKY BARRIER. Features. RECTIFIER. 8.0 AMPERES, 35 VOLTS. DPAK. CASE 369C

31 предложений от 15 поставщиков Диод: выпрямительный Шоттки; SMD; 35В; 8А; DPAK; туба |
| SBRD8835LG ON Semiconductor | 37 ₽ | |
| SBRD8835LG
| от 65 ₽ | |
| SBRD8835LG ON Semiconductor | от 203 ₽ | |
| SBRD8835LG ON Semiconductor | от 214 ₽ | |
Модельный ряд для этого даташита
Текстовая версия документа
Switch-mode Power Rectifier
DPAK Surface Mount Package
MBRD835L, SBRD8835L This switch−mode power rectifier which uses the Schottky Barrier principle with a proprietary barrier metal, is designed for use as output
www.onsemi.com
rectifiers, free wheeling, protection and steering diodes in switching power supplies, inverters and other inductive switching circuits.
SCHOTTKY BARRIER Features RECTIFIER
• Low Forward Voltage
8.0 AMPERES, 35 VOLTS
• 150°C Operating Junction Temperature • Epoxy Meets UL 94 V−0 @ 0.125 in • Compact Size • Lead Formed for Surface Mount
DPAK
•
CASE 369C
SBRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 1 Qualified and PPAP Capable 4 3 • These Devices are Pb−Free and are RoHS Compliant
MARKING DIAGRAM Mechanical Characteristics
• Case: Epoxy, Molded AYWW B • Weight: 0.4 Gram (Approximately) 835LG • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable B835LG = Specific Device Number A = Assembly Location* • Lead and Mounting Surface Temperature for Soldering Purposes: Y = Year 260°C Max. for 10 Seconds WW = Work Week • Shipped 75 Units Per Plastic Tube G = Pb−Free Device • ESD Rating: * The Assembly Location Code (A) is front side optional. In cases where the Assembly Location is ♦ Machine Model = C (> 400 V) stamped in the package bottom (molding ejecter ♦ Human Body Model = 3B (> 8000 V) pin), the front side assembly code may be blank.
ORDERING INFORMATION Device Package Shipping
† MBRD835LG DPAK 75 Units / Rail (Pb−Free) SBRD8835LG DPAK 75 Units / Rail (Pb−Free) SBRD8835LG−VF01 DPAK 75 Units / Rail (Pb−Free) MBRD835LT4G DPAK 2,500 / (Pb−Free) Tape & Reel SBRD835LT4G−VF01 DPAK 2,500 / (Pb−Free) Tape & Reel SBRD8835LT4G DPAK 2,500 / (Pb−Free) Tape & Reel SBRD8835LT4G−VF01 DPAK 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure BRD8011/D © Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
August, 2020 − Rev. 13 MBRD835L/D