DWG NO. 98W0004TO005 ASE Advanced PACKAGE Semiconductor ISSUE A Engineering Weihai, Inc. OUTLINE DATE May.20, 2016 NOTE ; 1. ALL METAL SURFACES: TIN PLATED,EXCEPT AREA OF CUT Package Dimensions 2. DIMENSIONING & TOLERANCEING CONFIRM TO DWG NO. 98W0004TO005 ASME Y14.5M-1994. Package TO-247-4L Plus ASEAdvanced PACKAGE Semiconductor ISSUE A 3. ALL DIMENSIONS ARE IN MILLIMETERS. Engineering Weihai, Inc. OUTLINE DATE May.20, 2016 ANGLES ARE IN DEGREES. E MILLIMETERS SYM E1 MIN MAX E3 E4 A 4.83 5.21 A1 2.29 2.54 A2 1.91 2.16 b' 1.07 1.28 b 1.07 1.33 E2 b1 2.39 2.94 b2 2.39 2.84 b3 1.07 1.60 b4 1.07 1.50 b5 2.39 2.69 b6 2.39 2.64 c' 0.55 0.65 c 0.55 0.68 D 23.30 23.60 D1 16.25 17.65 D2 0.95 1.25 E 15.75 16.13 E1 13.10 14.15 E2 3.68 5.10 E3 1.00 1.90 E4 12.38 13.43 e 2.54 BSC BASE METAL e1 5.08 BSC N 4 L 17.31 17.82 L1 3.97 4.37 L2 2.35 2.65 Q 5.49 6.00 SECTION "F-F", "G-G" AND "H-H" T 17.5° REF. SCALE: NONE W 3.5 ° REF. X 4 ° REF. TITLE: COMPANY ASE Weihai TO-247 Plus 4 LD SHEET 1 OF 3 TITLE: COMPANY ASE Weihai TO-247 Plus 4LD SHEET 2 OF 3 9 C2M0080170P Rev. A, 05-2018
