AIS2IH Datasheet MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications Features • AEC-Q100 qualified • ±2g/±4g/±8g/±16g dynamically selectable full scales • Low power consumption down to 110 µA in high-performance mode and 0.67 µA @ 1.6 Hz in low-power mode • Very low noise: down to 90 µg/√(Hz) in high-performance mode • Multiple operating modes with multiple bandwidths and resolution LGA-12 (2 x 2 x 0.93 mm3) • Single data conversion on demand • High-speed I²C/SPI digital output interface Product status link • 32-level FIFO • 2 independent programmable interrupts AIS2IH • Extended temperature range: -40 °C to 115 °C Product summary • Supply voltage, 1.62 V to 3.6 V Order code AIS2IHTR • Independent IO supply • Embedded temperature sensor Temp. range [°C] -40 to +115 • Self-test Package LGA-12 • 10000 g high shock survivability Packing Tape and reel • ECOPACK, RoHS and “Green” compliant Applications • Tilt / inclination measurement • Telematics and black boxes • In-dash car navigation • Anti-theft devices • Smart power saving • Motion-activated functions • Impact recognition and logging Description The AIS2IH is an ultra-low-power three-axis linear accelerometer which leverages on the robust and mature manufacturing processes already used for the production of micromachined accelerometers and designed to address non-safety automotive applications. The AIS2IH has user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of measuring accelerations with output data rates from 1.6 Hz to 1600 Hz. The AIS2IH has an integrated 32-level first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor. The device offers broad flexibility to applications as it can switch from ultra-low-power modes to high-resolution, high-performance modes on the fly. The embedded self-test capability allows the user to check the functioning of the sensor in the final application. DS12421 - Rev 4 - January 2021 www.st.com For further information contact your local STMicroelectronics sales office. Document Outline Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Mechanical and electrical specifications 2.1 Mechanical characteristics 2.2 Electrical characteristics 2.3 Temperature sensor characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface 2.4.2 I²C - inter-IC control interface 2.5 Absolute maximum ratings 3 Terminology and functionality 3.1 Terminology 3.1.1 Sensitivity 3.1.2 Zero-g level offset 3.2 Functionality 3.2.1 Operating modes 3.2.2 Single data conversion on-demand mode 3.2.3 Self-test 3.2.4 Activity/Inactivity, stationary/motion detection functions 3.2.5 High tap/double-tap user configurability 3.2.6 Offset management 3.3 Sensing element 3.4 IC interface 3.5 Factory calibration 3.6 Temperature sensor 4 Application hints 5 Digital main blocks 5.1 Block diagram of filters 5.2 Data stabilization time vs. ODR/device setting 5.3 FIFO 5.3.1 Bypass mode 5.3.2 FIFO mode 5.3.3 Continuous mode 5.3.4 Continuous-to-FIFO mode 5.3.5 Bypass-to-Continuous mode 6 Digital interfaces 6.1 I²C serial interface 6.1.1 I²C operation 6.2 SPI bus interface 6.2.1 SPI read 6.2.2 SPI write 6.2.3 SPI read in 3-wire mode 7 Register mapping 8 Register description 8.1 OUT_T_L (0Dh) 8.2 OUT_T_H (0Eh) 8.3 WHO_AM_I (0Fh) 8.4 CTRL1 (20h) 8.5 CTRL2 (21h) 8.6 CTRL3 (22h) 8.7 CTRL4_INT1_PAD_CTRL (23h) 8.8 CTRL5_INT2_PAD_CTRL (24h) 8.9 CTRL6 (25h) 8.10 OUT_T (26h) 8.11 STATUS (27h) 8.12 OUT_X_L (28h) 8.13 OUT_X_H (29h) 8.14 OUT_Y_L (2Ah) 8.15 OUT_Y_H (2Bh) 8.16 OUT_Z_L (2Ch) 8.17 OUT_Z_H (2Dh) 8.18 FIFO_CTRL (2Eh) 8.19 FIFO_SAMPLES (2Fh) 8.20 TAP_THS_X (30h) 8.21 TAP_THS_Y (31h) 8.22 TAP_THS_Z (32h) 8.23 INT_DUR (33h) 8.24 WAKE_UP_THS (34h) 8.25 WAKE_UP_DUR (35h) 8.26 FREE_FALL (36h) 8.27 STATUS_DUP (37h) 8.28 WAKE_UP_SRC (38h) 8.29 TAP_SRC (39h) 8.30 SIXD_SRC (3Ah) 8.31 ALL_INT_SRC (3Bh) 8.32 X_OFS_USR (3Ch) 8.33 Y_OFS_USR (3Dh) 8.34 Z_OFS_USR (3Eh) 8.35 CTRL7 (3Fh) 9 Package information 9.1 Soldering information 9.2 LGA-12 package information 9.3 LGA-12 packing information Revision history Contents List of tables List of figures
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