Datasheet ADT7461 (ON Semiconductor) - 2

ADT7461 ON-CHIP CONVERSION RATE ADDRESS POINTER TEMPERATURE REGISTER REGISTER SENSOR LOCAL TEMPERATURE LOCAL TEMPERATURE VALUE REGISTER LOW LIMIT REGISTER LOCAL TEMPERATURE ANALOG HIGH LIMIT REGISTER ADC AL MUX LIMIT MUX COMPARATOR REMOTE TEMPERATURE BUSY RUN/STANDBY DIGIT LOW LIMIT REGISTER D+ AL MUX 2 REMOTE TEMPERATURE REMOTE TEMPERATURE SRC VALUE REGISTER HIGH LIMIT REGISTER BLOCK DIGIT D− 3 LOCAL THERM LIMIT REGISTER REMOTE OFFSET EXTERNAL THERM LIMIT REGISTER REGISTER CONFIGURATION REGISTER EXTERNAL DIODE OPEN-CIRCUIT INTERRUPT STATUS REGISTER MASKING ADT7461 SMBUS INTERFACE 1 5 7 8 4 6 VDD GND SDATA SCLK THERM ALERT/ THERM2 Figure 1. Functional Block Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit
Positive Supply Voltage (VDD) to GND −0.3, +5.5 V D+ −0.3 to VDD + 0.3 V D− to GND −0.3 to +0.6 V SCLK, SDATA, ALERT −0.3 to +5.5 V THERM −0.3 to VDD + 0.3 V Input Current, SDATA, THERM −1, +50 mA Input Current, D− ±1 mA ESD Rating, All Pins (Human Body Model) 2000 V Maximum Junction Temperature (TJ Max) 150 °C Storage Temperature Range −65 to +150 °C IR Reflow Peak Temperature 220 °C IR Reflow Peak Temperature for Pb-Free 260 (±0.5) °C Lead Temperature (Soldering 10 sec) 300 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
Table 2. THERMAL CHARACTERISTICS Package Type qJA Unit
8-lead SOIC NB Package 121 °C/W 8-lead MSOP Package 142 °C/W
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