MMBZ5225 to MMBZ5267www.vishay.com Vishay Semiconductors
Small Signal Zener Diodes FEATURES• Silicon planar power Zener diodes Available 3 • Standard Zener voltage tolerance is ± 5 % with a “B” suffix (e.g.: MMBZ5225B), suffix “C” is ± 2 % tolerance. • High temperature soldering guaranteed: 1 2 260 °C/4 x 10 s at terminals • AEC-Q101 qualified available • ESD capability according to AEC-Q101: Human body model > 8 kV
DESIGN SUPPORT TOOLSclick logo to get started Machine model > 800 V • Base P/N-E3 - RoHS-compliant, commercial grade Models Available • Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS PARAMETER VALUE UNITVZ range nom. 3 to 75 V Test current IZT 1.7 to 20 mA VZ specification Thermal equilibrium Circuit configuration Single
ORDERING INFORMATION DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITYMMBZ5225B-E3-08 to MMBZ5267B-E3-08 MMBZ5225C-E3-08 to MMBZ5267C-E3-08 3000 (8 mm tape on 7" reel) 15 000/box MMBZ5225B-HE3-08 to MMBZ5267B-HE3-08 MMBZ5225 to MMBZ5225C-HE3-08 to MMBZ5267C-HE3-08 MMBZ5267 MMBZ5225B-E3-18 to MMBZ5267B-E3-18 MMBZ5225C-E3-18 to MMBZ5267C-E3-18 10 000 (8 mm tape on 13" reel) 10 000/box MMBZ5225B-HE3-18 to MMBZ5267B-HE3-18 MMBZ5225C-HE3-18 to MMBZ5267C-HE3-18
PACKAGE MOLDING COMPOUND MOISTURE SENSITIVITY PACKAGE NAME WEIGHT SOLDERING CONDITIONS FLAMMABILITY RATING LEVELMSL level 1 SOT-23 8.8 mg UL 94 V-0 260 °C/10 s at terminals (according J-STD-020)
ABSOLUTE MAXIMUM RATINGS(Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNITOn FR - 5 board using recommended solder pad layout Ptot 225 mW Power dissipation On alumina substrate Ptot 300 mW Zener current See table “Electrical Characteristics” Thermal resistance, On FR - 5 board using recommended solder pad layout R junction to ambient air thJA 556 K/W Junction temperature Tj 150 °C Storage temperature range Tstg -65 to +150 °C Operating temperature range Top -55 to +150 °C Rev. 1.9, 13-Feb-18
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