Datasheet MC10EL16, MC100EL16 (ON Semiconductor) - 6

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOIC−8 NB
8 CASE 751−07 1 ISSUE AK DATE 16 FEB 2011
SCALE 1:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5
PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S
0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1
IN EXCESS OF THE D DIMENSION AT
4 −Y− K
MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS INCHES G DIM MIN MAX MIN MAX A
4.80 5.00 0.189 0.197
C N X 45
_
B
3.80 4.00 0.150 0.157
SEATING C
1.35 1.75 0.053 0.069
PLANE D
0.33 0.51 0.013 0.020
−Z− G
1.27 BSC 0.050 BSC
H
0.10 0.25 0.004 0.010 0.10 (0.004)
J
0.19 0.25 0.007 0.010
H M J D K
0.40 1.27 0.016 0.050
M
0 8 0 8 _ _ _ _
N
0.25 0.50 0.010 0.020
S
5.80 6.20 0.228 0.244 0.25 (0.010) M Z Y S X S
GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT*
8 8 8 8 XXXXX XXXXX XXXXXX XXXXXX ALYWX ALYWX AYWW 1.52 AYWW G G 0.060 1 1 1 1
IC IC Discrete Discrete (Pb−Free) (Pb−Free)
7.0 4.0 XXXXX = Specific Device Code XXXXXX = Specific Device Code 0.275 0.155 A = Assembly Location A = Assembly Location L = Wafer Lot Y = Year Y = Year WW = Work Week W = Work Week G = Pb−Free Package G = Pb−Free Package 0.6 1.270 *This information is generic. Please refer to 0.024 0.050 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may SCALE 6:1 ǒ mm Ǔ inches not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42564B
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DESCRIPTION: SOIC−8 NB PAGE 1 OF 2
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