Datasheet T1610, T1635, T1650, BTA16, BTB16 (STMicroelectronics) - 6

T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) Figure 12. D²PAK thermal resistance junction to ambient versus copper surface under tab
Rth(j-a) (°C/W) 80 D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu(cm²) 0 0 5 10 15 20 25 30 35 40
DS2114
-
Rev 11 page 6/18
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 TO-220AB Insulated and non Insulated package information 2.1.1 TO-220AB Insulated and non Insulated package information 2.2 D²PAK package information 2.2.1 D²PAK package information 3 Ordering information 3.1 Product selector 3.2 Ordering information Revision history