Datasheet ASMT-Rx45-xxxxx (Broadcom) - 5

ASMT-Rx45-xxxxx
Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED
Figure 7: Recommended Reflow Soldering Profile Figure 8: Recommended Pb-Free Reflow Soldering Profile 10 SEC. MAX. 10 to 30 SEC. 255 - 260ºC 230ºC/ MAX. 3ºC/SEC. MAX. 217ºC 200ºC 140-160 4ºC/SEC. MAX. 6ºC/SEC. MAX. 150ºC TEMPERATURE TEMPERATURE 4ºC/SEC. -3ºC/SEC. 3ºC/SEC. MAX. MAX. MAX. 60 - 120 SEC. 100 SEC. MAX. OVER 2 MIN. TIME TIME (Acc. to J-STD-020C) NOTE:
For detailed information on reflow soldering of Broadcom surface mount LEDs, refer to Broadcom Application Note AN1060, Surface Mounting SMT LED Indicator Components.
Figure 9: Tape Dimensions 4.00 DIM. C [0.157] [SEE TABLE 1] 1.50 0.254 +/- 0.02 [0.059] 4.00 [0.01 +/- 0.001] [0.157] 1.75 [0.069] 3.50 +/- 0.05 8.00 +/- 0.30 [0.315 +/- 0.012] DIM. A [0.14 +/- 0.002] [SEE TABLE] CARRIER TAPE Diam. 0.60 +/- 0.05 DIM. B USER FEED COVER TAPE [SEE TABLE] DIRECTION Figure 10: Reeling Orientation USER FEED DIRECTION CATHODE SIDE PRINTED LABEL
Broadcom AV02-0378EN 5 Document Outline Description Features Applications Package Dimensions Device Selection Guide Part Numbering System Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Color Bin Select (X5) Packaging Option (X6) Forward Voltage (VF) Bin Limits Color Bin Limits Yellow Green Color Bin Yellow/Amber Color Bin Orange Color Bin Red Color Bin Red Orange Color Bin Moisture Sensitivity