Datasheet SG1524, SG2524, SG3524 (Microchip) - 6

Connection Diagrams and Ordering Information (See Notes Below)
Ambient Package Part No. Connection Diagram Temperature Range
16-PIN CERAMIC DIP SG1524J-883B -55°C to 125°C INV. INPUT 1 16 VREF J - PACKAGE SG1524J-JAN -55°C to 125°C N.I. INPUT 2 15 +VIN OSC. OUTPUT 3 14 E SG1524J-DESC -55°C to 125°C B +C.L. SENSE 4 13 CB SG1524J -55°C to 125°C -C.L. SENSE 5 12 CA SG2524J -25°C to 85°C R 6 11 E T A SG3524J 0°C to 70°C C 7 10 SHUTDOWN T GROUND 8 9 COMPENSATION 16-PIN PLASTIC DIP SG2524N -25°C to 85°C N - PACKAGE SG3524N 0°C to 70°C N Package: RoHS / Pb-free Transition DC: 0503*. 100% Matte Tin Lead Finish 16-PIN NARROW BODY SG2524D -25°C to 85°C INV. INPUT 1 16 VREF PLASTIC SOIC N.I. INPUT 2 15 +V SG3524D IN 0°C to 70°C D - PACKAGE OSC. OUTPUT 3 14 EB +C.L. SENSE 4 13 CB -C.L. SENSE 5 12 CA R 6 11 E T A C 7 10 SHUTDOWN T GROUND 8 9 COMPENSATION RoHS / Pb-free transition DC:0440 Pb-free / RoHS 100% Matte Tin Lead Finish* 20-PIN CERAMIC 3 2 1 20 19 SG1524L-883B -55°C to 125°C 1. N.C. 11. COMP LEADLESS CHIP CARRIER SG1524L -55°C to 125°C 2. V 12. SHUTDOWN REF L- PACKAGE 4 3. INV. INPUT 18 13. N.C. 4. N.I. INPUT 5 17 14. EA 5. OSC. OUTPUT 15. C 6 16 A 6. + C.L. SENSE 16. N.C. 7 15 7. - C.L. SENSE 17. CB 8. R 8 14 18. E T B 9. C 19. N.C. T 10. GROUND 20. +V 9 10 11 12 13 IN *RoHS compliant Note 1. Contact factory for JAN product availablity. 2. All packages are viewed from the top. 3. Hermetic Packages J & L use Pb37/Sn63 hot solder lead finish, contact factory for availability of RoHS versions. 6 Document Outline Regulating Pulse Width Modulator Description Features High Reliability Features Block Diagram Absolute Maximum Ratings Thermal Data Recommended Operating Conditions Electrical Characteristics Electrical Characteristics (Continued) Application Notes Application Notes (Continued) Connection Diagrams and Ordering Information Package Outline Dimensions Package Outline Dimensions (continued)