Datasheet SG1524, SG2524, SG3524 (Microchip) - 7

Package Outline Dimensions Package Outline Dimensions Controlling dimensions are in inches, metric equivalents are shown for general information. MILLIMETERS INCHES D
DIM MIN MAX MIN MAX
- - 16 9 A 5.08 0.200 b 0.38 0.51 0.015 0.020 E b2 1.04 1.65 0.045 0.065 1 8 c 0.20 0.38 0.008 0.015 eA D 19.30 19.94 0.760 0.785 b2 E 5.59 7.11 0.220 0.280 e 2.54 BSC 0.100 BSC Q A eA 7.37 7.87 0.290 0.310 H 0.63 1.78 0.025 0.070 Seating Plane L c L 3.18 5.08 0.125 0.200 θ θ - 15° - 15° H e b Q 0.51 1.02 0.020 0.040
Note:
Dimensions do not include protrusions; these shall not exceed 0.155mm (.006”) on any side. Lead dimension shall not include solder coverage.
Figure 5 · J
16-Pin Ceramic Dip MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A - 5.33 - 0.210 D A1 0.38 - 0.015 - A2 3.30 Typ. 0.130 Typ. E1 b 0.36 0.56 0.014 0.022 1 b1 1.14 1.78 0.045 0.070 b1 c 0.20 0.36 0.008 0.014 E D 18.67 19.69 0.735 0.775 e 2.54 BSC 0.100 BSC A2 A E 7.62 8.26 0.300 0.325 c A1 E1 6.10 7.11 0.240 0.280 L L 2.92 0.381 0.115 0.150 e SEATING PLANE θ b θ - 15° - 15°
Note:
Dimensions do not include protrusions; these shall not exceed 0.155mm (.006”) on any side. Lead dimension shall not include solder coverage.
Figure 6 · N
16-Pin Plastic Dual Inline Package Dimensions 7 Document Outline Regulating Pulse Width Modulator Description Features High Reliability Features Block Diagram Absolute Maximum Ratings Thermal Data Recommended Operating Conditions Electrical Characteristics Electrical Characteristics (Continued) Application Notes Application Notes (Continued) Connection Diagrams and Ordering Information Package Outline Dimensions Package Outline Dimensions (continued)