Datasheet SG1524, SG2524, SG3524 (Microchip) - 8

Package Outline Dimensions(continued) MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.52 0.049 0.060 b 0.33 0.51 0.013 0.020 c 0.19 0.25 0.007 0.010 D 9.78 10.01 0.385 0.394 E 5.79 6.20 0.228 0.244 e 1.27 BSC 0.050 BSC H 3.81 4.01 0.150 0.158 L 0.40 1.27 0.016 0.050 Θ 0 8 0 8 *LC - 0.10 - 0.004 *Lead Coplanarity
Note:
Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm (.006”) on any side. Lead dimension shall not include solder coverage.
Figure 7 · D
16-Pin Plastic SOIC E3 D MILLIMETERS INCHES
DIM MIN MAX MIN MAX
D/E 8.64 9.14 0.340 0.360 E3 - 8.128 - 0.320 E e 1.270 BSC 0.050 BSC B1 0.635 TYP 0.025 TYP L 1.02 1.52 0.040 0.060 A 1.626 2.286 0.064 0.090 h 1.016 TYP 0.040 TYP A L2 L A1 8 A1 1.372 1.68 0.054 0.066 A2 - 1.168 - 0.046 3 L2 1.91 2.41 0.075 0.95 B3 0.203R 0.008R 1
Note:
All exposed metalized area shall be gold plated 60 micro- inch minimum thickness over nickel plated unless 13 otherwise specified in purchase order. h A2 18B1 e B3
Figure 8 · L
20-Pin Ceramic LCC Package Outline Dimensions 8 Document Outline Regulating Pulse Width Modulator Description Features High Reliability Features Block Diagram Absolute Maximum Ratings Thermal Data Recommended Operating Conditions Electrical Characteristics Electrical Characteristics (Continued) Application Notes Application Notes (Continued) Connection Diagrams and Ordering Information Package Outline Dimensions Package Outline Dimensions (continued)