Datasheet NCP502, NCV502 (ON Semiconductor) - 3

NCP502, NCV502 ELECTRICAL CHARACTERISTICS
(Vin = Vout(nom.) + 2.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TJ = 25°C, unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Output Voltage (TA = 25°C, Iout = 10 mA) Vin = Vout (nom.) +1.0 V Vout V 1.5 V 1.455 1.5 1.545 1.8 V 1.746 1.8 1.854 2.5 V 2.425 2.5 2.575 2.7 V 2.646 2.7 2.754 2.8 V 2.744 2.8 2.856 2.9 V 2.842 2.9 2.958 3.0 V 2.94 3.0 3.06 3.1 V 3.038 3.1 3.162 3.3 V 3.234 3.3 3.366 3.4 V 3.332 3.4 3.468 3.5 V 3.43 3.5 3.57 3.6 V 3.528 3.6 3.672 3.7 V 3.626 3.7 3.774 5.0 V 4.900 5.0 5.100 Output Voltage (TA = Tlow to Thigh, Iout = 10 mA) Vin = Vout (nom.) Vout V 1.5 V 1.455 1.5 1.545 1.8 V 1.746 1.8 1.854 2.5 V 2.425 2.5 2.575 2.7 V 2.619 2.7 2.781 2.8 V 2.716 2.8 2.884 2.9 V 2.813 2.9 2.987 3.0 V 2.910 3.0 3.09 3.1 V 3.007 3.1 3.193 3.3 V 3.201 3.3 3.399 3.4 V 3.298 3.4 3.502 3.5 V 3.43 3.5 3.57 3.6 V 3.528 3.6 3.672 3.7 V 3.626 3.7 3.774 5.0 V 4.900 5.0 5.100 Line Regulation (Vin = Vout + 1.0 V to 12 V, Iout = 10 mA) Regline − 0.4 3.0 mV/V Load Regulation (Iout = 1.0 mA to 80 mA) Regload − 0.2 0.8 mV/mA Output Current (Vout = (Vout at Iout = 80 mA) −3%) Io(nom.) 80 180 − mA Dropout Voltage (TA = Tlow to Thigh, Iout = 80 mA, Measured at Vout Vin−Vout mV −3.0%) 1.5 V−1.7 V − 1500 1900 1.8 V−2.4 V − 1300 1700 2.5 V−2.6 V − 1000 1400 2.7 V−2.9 V − 850 1300 3.0 V−4.0 V − 850 1200 4.1 V−5.0 V − 600 900 NCV502 − 5.0 V − 700 1100 Quiescent Current IQ A (Enable Input = 0 V) − 0.1 1.0 (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) − 40 90 Output Short Circuit Current (Vout = 0 V) Iout(max) 90 200 500 mA Ripple Rejection (f = 1.0 kHz, 15 mA) RR − 55 − dB Output Voltage Noise (f = 100 Hz to 100 kHz) Vn − 180 − Vrms Enable Input Threshold Voltage (NCP502) Vth(en) V (Voltage Increasing, Output Turns On, Logic High) 1.3 − − (Voltage Decreasing, Output Turns Off, Logic Low) − − 0.3 Output Voltage Temperature Coefficient TC − 100 − ppm/°C 4. Maximum package power dissipation limits must be observed. T PD + J(max) *TA RJA 5. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
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