Datasheet NCP502, NCV502 (ON Semiconductor) - 9

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS TSOP−5
CASE 483 5 ISSUE N 1 DATE 12 AUG 2020
SCALE 2:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME
NOTE 5
Y14.5M, 1994.
D 5X
2. CONTROLLING DIMENSION: MILLIMETERS. 0.20 C A B 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
2X
0.10 T THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
M
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
5 4
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
2X
0.20 T
B S
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
1 2 3
EXCEED 0.15 PER SIDE. DIMENSION A.
K
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
B G DETAIL Z
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY.
A A MILLIMETERS TOP VIEW DIM MIN MAX A
2.85 3.15
B
1.35 1.65
DETAIL Z C
0.90 1.10
D
0.25 0.50
J G
0.95 BSC
C H
0.01 0.10 0.05
J
0.10 0.26
H K
0.20 0.60
C SEATING END VIEW PLANE M
0 10 _ _
SIDE VIEW S
2.50 3.00
GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
1.9 0.074 5 5 0.95 XXXAYWG XXX MG 0.037 G G 1 1
Analog Discrete/Logic
2.4 XXX = Specific Device Code XXX = Specific Device Code 0.094 A = Assembly Location M = Date Code Y = Year G = Pb−Free Package 1.0 W = Work Week 0.039 G = Pb−Free Package (Note: Microdot may be in either location) 0.7 *This information is generic. Please refer to 0.028 SCALE 10:1 ǒ mm Ǔ inches device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, *For additional information on our Pb−Free strategy and soldering may or may not be present. details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ARB18753C
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: TSOP−5 PAGE 1 OF 1
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