Datasheet ESDAxxSCx (STMicroelectronics) - 6

Package information ESDAxxSCx 3 Package information
• Epoxy meets UL94, V0 standard In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free. The category of second level Interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Table 5. SOT23-5L dimensions Dimensions Ref. Millimeters Inches A Min. Typ. Max. Min. Typ. Max. E
A 0.90 1.45 0.035 0.057 A1 0 0.10 0 0.004
e
A2 0.90 1.30 0.035 0.051
B D e
b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008
A2
D 2.80 3.05 0.11 0.118 E 1.50 1.75 0.059 0.069 e 0.95 0.037
c A1
θ
L
H 2.60 3.00 0.102 0.118
H
L 0.10 0.60 0.004 0.024 M 0° 10° 0° 10°
Figure 10. SOT23-5L footprint (dimensions in mm) 0.60 1.20 0.95 3.50 2.30 1.10
6/9 DocID7056 Rev 10 Document Outline Figure 1. ESDAxxSC5 functional diagram Figure 2. ESDAxxSC6 functional diagram Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (Tamb = 25 °C) Table 3. Electrical characteristics - definitions (Tamb = 25 °C) Table 4. Electrical characteristics - values (Tamb = 25 °C) Figure 3. Peak power dissipation versus initial junction temperature Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) Figure 5. Clamping voltage versus peak pulse current (Tj initial = 25 °C). Rectangular waveform tp = 2.5 µs Figure 6. Capacitance versus reverse applied voltage Figure 7. Relative variation of leakage current versus junction temperature Figure 8. Peak forward voltage drop versus peak forward current 2 Ordering information Figure 9. Ordering information scheme 3 Package information Table 5. SOT23-5L dimensions Figure 10. SOT23-5L footprint (dimensions in mm) Table 6. SOT23-6L dimensions Figure 11. SOT23-6L footprint (dimensions in mm) 4 Ordering information Table 7. Ordering information 5 Revision history Table 8. Document revision history