Datasheet NXS0506 (Nexperia)

NXS0506 SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection Rev. 1 — 31 January 2022 Product data sheet 1. General description
The NXS0506 is an SD 3.0-compatible bidirectional dual supply level translator with auto-direction control. It is designed to interface between a memory card operating at 1.7 V to 3.6 V signal levels and a host with a nominal supply voltage of 1.1 V to 1.95 V. The device supports SD 3.0: SDR104, SDR50, DDR50, SDR25, SDR12 and SD 2.0 High-Speed (50 MHz) and Default-Speed (25 MHz) modes. The device has a built-in EMI filter and robust ESD protection (IEC 61000-4-2, level 4).
2. Features and benefits
• Supports up to 208 MHz clock rate • SD 3.0 specification-compatible voltage translation to support: SDR104, SDR50, DDR50, SDR25, SDR12, High-Speed and Default-Speed modes • 1.1 V to 1.95 V host side interface voltage support • Auto-direction sensing • Low power consumption • Integrated pull-up resistors: no external resistors required • Integrated EMI filters suppress higher harmonics of digital I/Os • Level shifting buf ers keep ESD stress away from the host (zero-clamping concept) • 16-bumps WLCSP package; pitch 0.35 mm • ESD protection: • HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV • CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 1 kV • IEC61000-4-2, level 4, contact discharge on all memory card-side pins exceeds 8 kV • IEC61000-4-2, level 4, air discharge on all memory card-side pins exceeds 15 kV • Specified from -40 °C to +85 °C
3. Applications
• Smartphone • Mobile handsets • Digital cameras • Tablet PCs • Laptop computers • SD, MMC or microSD card readers Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 5. Marking 6. Block diagram 7. Functional diagram 8. Pinning information 8.1. Pinning 8.2. Pin description 9. Functional description 9.1. Level translator 9.2. Enable and direction control 9.3. Feedback clock channel 9.4. EMI filter 9.5. ESD protection 9.6. Pin and channel naming 10. Limiting values 11. Recommended operating conditions 12. Static characteristics 13. Dynamic characteristics 13.1. Level translator 14. Application information 14.1. PCB design guidelines 15. Design and assembly recommendations 15.1. PCB design guidelines 15.2. PCB assembly guidelines for Pb-free soldering 16. Package outline 17. Abbreviations 18. Revision history 19. Legal information Contents