BARE DIE PACKING OPTIONSBARE DIE IN TRAY (WAFFLE) PACK CT : Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT)CM : Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM)UNSAWN WAFER WN : Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN)SAWN WAFER ON PLASTIC RING WR : Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs R2 (3-April 2017) www.centra lsemi.com
