Datasheet ADG1401, ADG1402 (Analog Devices) - 7

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ADG1401/ADG1402 ABSOLUTE MAXIMUM RATINGS
T
THERMAL RESISTANCE
A = 25°C, unless otherwise noted.
Table 5. Table 6. Thermal Resistance Parameter Rating Package Type θJA θJC Unit
V 8-Lead MSOP (4-Layer Board) 206 44 °C/W DD to VSS 35 V V 8-Lead LFCSP 50.8 °C/W DD to GND −0.3 V to +25 V VSS to GND +0.3 V to −25 V Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or
ESD CAUTION
30 mA, whichever occurs first Digital Inputs1 GND − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first Peak Current, S or D (Pulsed at 1 ms, 10% Duty-Cycle Maximum) 8-Lead MSOP (4-Layer Board) 500 mA 8-Lead LFCSP 700 mA Continuous Current per Data in Table 4 + 15% Channel, S or D Operating Temperature Range Industrial −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Reflow Soldering Peak 260°C Temperature, Pb Free 1 Over voltages at IN, S, or D are clamped by internal diodes. Current should be limited to the maximum ratings given. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY +12 V SINGLE SUPPLY ±5 V DUAL SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE