Datasheet ADG1201 (Analog Devices) - 6

ADG1201 Data Sheet ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Close attention to V PCB thermal design is required. DD to VSS 35 V VDD to GND −0.3 V to +25 V θJA is the natural convection, junction to ambient thermal VSS to GND +0.3 V to −25 V resistance measured in a one cubic foot sealed enclosure. θJC is Analog Inputs1 VSS – 0.3 V to VDD + 0.3 V or the junction to case thermal resistance. 30 mA, whichever occurs first Digital Inputs1 GND – 0.3 V to V
Table 4. Thermal Resistance
DD + 0.3 V or 30 mA, whichever occurs first
Package Type θJA θJC Unit
Peak Current, S or D 100 mA (pulsed at 1 ms, 10% RJ-61 229.6 91.99 °C/W duty cycle maximum) Continuous Current per 30 mA 1 Thermal impedance values measured on a JEDEC 1S2P thermal test board. Channel, S or D See JEDEC JESD-51. Temperature Industrial Range −40°C to +125°C
ESD CAUTION
Storage Range −65°C to +150°C Junction 150°C Reflow Soldering Peak, Pb- 260°C Free 1 Overvoltages at IN, S, or D are clamped by internal diodes. Current must be limited to the maximum ratings given. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 6 of 14 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Dual Supply Single Supply Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits Terminology Outline Dimensions Ordering Guide