Datasheet ADG658-EP (Analog Devices) - 10

ADG658-EP Enhanced Product OUTLINE DIMENSIONS 5.10 5.00 4.90 16 9 4.50 6.40 4.40 BSC 4.30 1 8 PIN 1 1.20 MAX 0.15 0.20 0.05 0.09 0.75 8° 0.60 0.30 0.65 0° 0.19 SEATING 0.45 BSC PLANE COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 10. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
ADG658TRUZ-EP −55°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG658TRUZ-EP-RL7 −55°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 1 Z = RoHS Compliant Part.
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Rev. 0 | Page 10 of 10 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY 5 V SINGLE SUPPLY 2.7 V TO 3.6 V SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE