ADG725/ADG731ABSOLUTE MAXIMUM RATINGS1 Storage Temperature Range . –65°C to +150°C (T Junction Temperature . 150°C A = 25°C, unless otherwise noted.) V Thermal Impedance (4-Layer Board) DD to VSS . 7 V V 48-lead LFCSP . 25°C/W DD to GND . –0.3 V to +7 V V 48-lead TQFP . 54.6°C/W SS to GND . +0.3 V to –7 V Analog Inputs2 . V Lead Temperature, Soldering (10 seconds) . 300°C SS – 0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First IR Reflow, Peak Temperature (<20 seconds) . 235°C Digital Inputs2 . –0.3 V to VDD + 0.3 V or NOTES 30 mA, Whichever Occurs First 1 Stresses above those listed under Absolute Maximum Ratings may cause perma- Peak Current, S or D . 60 mA nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational (Pulsed at 1 ms, 10% Duty Cycle max) sections of this specification is not implied. Exposure to absolute maximum rating Continuous Current, S or D . 30 mA conditions for extended periods may affect device reliability. Only one absolute Operating Temperature Range maximum rating may be applied at any one time. 2 Industrial (B Version) . –40°C to +85°C Overvoltages at SCLK, SYNC, DIN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the WARNING! ADG725/ADG731 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are ESD SENSITIVE DEVICE recommended to avoid performance degradation or loss of functionality. –6– REV. B
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