link to page 6 link to page 6 ADG824Data SheetABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings Table 4. may cause permanent damage to the device. This is a stress ParameterRating rating only; functional operation of the device at these or any other conditions above those indicated in the operational VDD to GND −0.3 V to +4.6 V section of this specification is not implied. Exposure to absolute Analog Inputs1 −0.3 V to VDD + 0.3 V maximum rating conditions for extended periods may affect Digital Inputs1 −0.3 V to +4.6 V or 10 mA, whichever occurs first device reliability. Peak Current, Sx or Dx Pins Pulsed at 1 ms, Only one absolute maximum rating may be applied at any 10% duty cycle max one time. 3.3 V Operation 500 mA 2.5 V Operation 460 mA 1.8 V Operation 420 mA ESD CAUTION Continuous Current, Sx or Dx Pins 3.3 V Operation 300 mA 2.5 V Operation 275 mA 1.8 V Operation 250 mA Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Mini LFCSP Package θJA Thermal Impedance 131.6°C/W (4-Layer Board) Reflow Soldering (Pb-Free) Peak Temperature 260°C Time at Peak Temperature 10 sec to 40 sec 1 Overvoltages at the INx, Sx, or Dx pins are clamped by internal diodes. Current should be limited to the maximum ratings given. Rev. C | Page 6 of 16 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits Terminology Outline Dimensions Ordering Guide
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