Datasheet BCP53; BCX53; BC53PA (Nexperia) - 6

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Nexperia BCP53; BCX53; BC53PA 80 V, 1 A PNP medium power transistors 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from in free air junction to ambient BCP53 [1] - - 192 K/W [2] - - 125 K/W [3] - - 93 K/W BCX53 [1] - - 250 K/W [2] - - 132 K/W [3] - - 93 K/W BC53PA [1] - - 298 K/W [2] - - 151 K/W [3] - - 114 K/W [4] - - 154 K/W [5] - - 76 K/W Rth(j-sp) thermal resistance from junction to solder point BCP53 - - 16 K/W BCX53 - - 16 K/W BC53PA - - 20 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2. BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 9 — 19 October 2011 6 of 22
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents