Datasheet STPS2H100 (STMicroelectronics) - 5

STPS2H100 Characteristics (curves) Figure 11. Junction capacitance versus reverse voltage Figure 12. Forward voltage drop versus forward current applied (typical values) (low level)
C(pF) IF(A) 100 2.0 F= 1MHz 1.8 VOS = C 30mVRMS Tj= 25°C T 1.6 j=125°C j=125 (Maximum values) (Maximum v 1.4 1.2 Tj T =125°C j=125 1.0 (Typical (T values) v 0.8 Tj=25°C 0.6 (Maximum values) 0.4 0.2 V VF(V) R( V) 10 0.0 1 1 0 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Figure 13. Forward voltage drop versus forward current Figure 14. Thermal resistance junction to ambient versus (high level) copper surface under each lead (SMA)
I Rth(j-a) (°C/W) F(A) 100 200 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Tj T =125°C j=125 (Maximum values) (Maximum v 150 Tj T =125°C j=125 (Typical (T values) v 10 100 T 50 j=25°C (Maximum values) V S F(V) (Cu)(cm²) 1 0 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA Flat Notch) Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (SMB)
Rth(j-a) (°C/W) Rth(j-a) (°C/W) 200 200 Epoxy printed circuit board FR4, copper thickness: 35 µm Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm SMB SMA Flat SMA Flat Notch 150 150 100 100 50 50 S(Cu)(cm²) S(Cu)(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DS1452
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Rev 10 page 5/19
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 SMA Flat package information 2.2 SMA Flat Notch package information 2.3 SMA package information 2.4 SMB package information 2.5 SMB Flat package information 3 Ordering Information Revision history