Смарт-ЭК - поставщик алюминиевых корпусов LinTai

Datasheet STTH1L06 (STMicroelectronics) - 7

ПроизводительSTMicroelectronics
ОписаниеTurbo 2 ultrafast high voltage rectifier
Страниц / Страница9 / 7 — STTH1L06. Package information. Table 7. SMB dimensions. Dimensions. Ref. …
Формат / Размер файлаPDF / 112 Кб
Язык документаанглийский

STTH1L06. Package information. Table 7. SMB dimensions. Dimensions. Ref. Millimeters. Inches. Min. Max. Figure 17

STTH1L06 Package information Table 7 SMB dimensions Dimensions Ref Millimeters Inches Min Max Figure 17

63 предложений от 30 поставщиков
Телевизионные диоды, STMICROELECTRONICS STTH1L06UFY Standard Recovery Diode, 600V, 1A, Single, 1.4V, 60ns, 20A
Контест
Россия
STTH1L06A
3.97 ₽
STTH1L06
STMicroelectronics
от 12 ₽
МосЧип
Россия
STTH1L06N
STMicroelectronics
по запросу
STTH1L06U
STMicroelectronics
по запросу

Модельный ряд для этого даташита

Текстовая версия документа

STTH1L06 Package information Table 7. SMB dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. D
A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087
E
c 0.15 0.40 0.006 0.016
A1
D 3.30 3.95 0.130 0.156
C A2
E 5.10 5.60 0.201 0.220
L b
E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059
Figure 17. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Table 8. DO-41 (plastic) dimensions Dimensions Ref. Millimeters Inches ØD ØB Min. Max. Min. Max.
A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107
C A C
C 25.4 1 D 0.71 0.86 0.028 0.034 Doc ID 8321 Rev 4 7/9 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration Figure 5. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) Figure 6. Peak reverse recovery current versus dIF/dt (90% confidence) Figure 7. Reverse recovery time versus dIF/dt (90% confidence) Figure 8. Reverse recovery charges versus dIF/dt (90% confidence) Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 2 Package information Table 6. SMA dimensions Figure 16. Footprint (dimensions in mm) Table 7. SMB dimensions Figure 17. Footprint (dimensions in mm) Table 8. DO-41 (plastic) dimensions 3 Ordering information Table 9. Ordering information 4 Revision history Table 10. Document revision history
ТМ Электроникс. Электронные компоненты и приборы. Скидки, кэшбэк и бесплатная доставка