Источники питания KEEN SIDE

Datasheet BAV99 (Nexperia) - 3

ПроизводительNexperia
ОписаниеHigh-speed switching diode
Страниц / Страница10 / 3 — Nexperia. BAV99. High-speed switching diode. 8. Limiting values Table 5. …
Версия01072022
Формат / Размер файлаPDF / 203 Кб
Язык документаанглийский

Nexperia. BAV99. High-speed switching diode. 8. Limiting values Table 5. Limiting values. Symbol. Parameter. Conditions. Min. Max. Unit

Nexperia BAV99 High-speed switching diode 8 Limiting values Table 5 Limiting values Symbol Parameter Conditions Min Max Unit

37 предложений от 16 поставщиков
Диод: импульсный; SMD; 100В; 215мА; 4нс; SOT23; Ufmax: 1,25В; Ifsm: 4А
AllElco Electronics
Весь мир
BAV99,235
Nexperia
от 0.58 ₽
AiPCBA
Весь мир
BAV99,235
TE Connectivity
0.75 ₽
727GS
Весь мир
BAV99,235
NXP
от 1.51 ₽
BAV99.235
по запросу
ХРОНИКИ РОСТА: причины увеличения доли китайских полупроводниковых компонентов

Модельный ряд для этого даташита

Текстовая версия документа

link to page 3 link to page 3
Nexperia BAV99 High-speed switching diode 8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit Per diode
VR reverse voltage - 100 V VRRM repetitive peak reverse - 100 V voltage IF forward current single diode loaded - 215 mA double diode loaded - 125 mA IFRM repetitive peak forward - 500 mA current IFSM non-repetitive peak tp = 1 µs; square wave; Tj(init) = 25 °C - 4 A forward current tp = 1 ms; square wave; Tj(init) = 25 °C - 1 A tp = 1 s; square wave; Tj(init) = 25 °C - 0.5 A
Per device; one diode loaded
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW Tj junction temperature - 150 °C Tamb ambient temperature -65 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from single diode loaded; in free air [1] - - 500 K/W junction to ambient Rth(j-sp) thermal resistance from - - 360 K/W junction to solder point [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BAV99 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet 1 July 2022 3 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
ТМ Электроникс. Электронные компоненты и приборы. Скидки, кэшбэк и бесплатная доставка