Поставки продукции Nuvoton по официальным каналам

Datasheet BSS123 (ON Semiconductor) - 2

ПроизводительON Semiconductor
ОписаниеN-Channel Logic Level Enhancement Mode Field Effect Transistor
Страниц / Страница7 / 2 — BSS123. ABSOLUTE MAXIMUM RATINGS. Symbol. Parameter. Ratings. Unit. …
Формат / Размер файлаPDF / 202 Кб
Язык документаанглийский

BSS123. ABSOLUTE MAXIMUM RATINGS. Symbol. Parameter. Ratings. Unit. THERMAL CHARACTERISTICS. ELECTRICAL CHARACTERISTICS

BSS123 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Ratings Unit THERMAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS

88 предложений от 38 поставщиков
Транзисторы разные.Тип: MOSFETТип проводимости: NМаксимальное напряжение сток-исток, В: 100Максимальный ток стока (при Ta=25C), А: 0,17Минимальное сопротивление открытого канала, мОм: 6000Емкость, пФ:...
ICdarom.ru
Россия
BSS123 YJ SOT23
от 0.93 ₽
Контест
Россия
BSS123
1.52 ₽
Augswan
Весь мир
BSS123A
NXP
по запросу
LifeElectronics
Россия
BSS123 E7874
Infineon
по запросу

Модельный ряд для этого даташита

Текстовая версия документа

link to page 3 link to page 3 link to page 3 link to page 3 link to page 3
BSS123 ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Symbol Parameter Ratings Unit
VDSS Drain−Source Voltage 100 V VGSS Gate−Source Voltage ±20 ID Drain Current – Continuous (Note 1) 0.17 A Drain Current – Pulsed (Note 1) 0.68 PD Maximum Power Dissipation (Note 1) 0.36 W Derate Above 25°C 2.8 mW/°C TJ, TSTG Operating and Storage Junction Temperature Range −55 to +150 °C TL Maximum Lead Temperature for Soldering Purposes, 1/16” from Case 300 for 10 s Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
TA = 25°C unless otherwise noted.
Symbol Parameter Ratings Unit
RJA Thermal Resistance, Junction−to−Ambient (Note 1) 350 °C/W
ELECTRICAL CHARACTERISTICS
TA = 25°C unless otherwise noted.
Symbol Parameter Test Conditions Min Typ Max Unit OFF CHARACTERISTICS
BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 A 100 − − V BV Breakdown Voltage Temperature I − 97 − mV/°C DSS D = 250 μA, Referenced to T Coefficient 25°C J IDSS Zero Gate Voltage Drain Current VDS = 100 V, VGS = 0 V − − 1 A VDS = 100 V, VGS = 0 V, − − 60 TJ = 125°C VDS = 20 V, VGS = 0 V − − 10 nA IGSS Gate–Body Leakage VGS = ±20 V, VDS = 0 V − − ±50 nA
ON CHARACTERISTICS
(Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 1 mA 0.8 1.7 2 V V Gate Threshold Voltage Temperature I GS(th) D = 1 mA, Referenced to 25°C − –2.7 − mV/°C Coefficient TJ RDS(on) Static Drain–Source On–Resistance VGS = 10 V, ID = 0.17 A − 1.2 6 VGS = 4.5 V, ID = 0.17 A − 1.3 10 VGS = 10 V, ID = 0.17 A, − 2.2 12 TJ = 125°C ID(on) On–State Drain Current VGS = 10 V, VDS = 5 V 0.68 − − A gFS Forward Transconductance VDS = 10 V, ID = 0.17 A 0.08 0.8 − S
DYNAMIC CHARACTERISTICS
Ciss Input Capacitance VDS = 25 V, VGS = 0 V, − 73 − pF f = 1.0 MHz Coss Output Capacitance − 7 − Crss Reverse Transfer Capacitance − 3.4 − RG Gate Resistance VGS = 15 mV, f = 1.0 MHz − 2.2 −
www.onsemi.com 2
ТМ Электроникс. Электронные компоненты и приборы. Скидки, кэшбэк и бесплатная доставка