Outline Dimensionswww.vishay.com Vishay Semiconductors
TO-220AC 2L DIMENSIONSin millimeters and inches A 0.014 M B A M (6) Thermal pad E A (E) A1 1 2 B Q Ø P (6) A D D H1 (H1) L1 (2) C C D2 (6) (6) D c D1 2 x b 2 x b2 Detail B Detail B A2 L E1 (6) C Base metal (b, b2) Plating A c c1 (4) 2 x e View A - A e1 (4) b1, b3 0.015 M B A M Section C - C and D - D Lead tip
Conforms to JEDEC® outline TO-220AC SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.A 4.25 4.65 0.167 0.183 D2 11.68 13.30 0.460 0.524 6, 7 A1 1.14 1.40 0.045 0.055 E 10.11 10.51 0.398 0.414 3, 6 A2 2.50 2.92 0.098 0.115 E1 6.86 8.89 0.270 0.350 6 b 0.69 1.01 0.027 0.040 e 2.41 2.67 0.095 0.105 b1 0.38 0.97 0.015 0.038 4 e1 4.88 5.28 0.192 0.208 b2 1.20 1.73 0.047 0.068 H1 6.09 6.48 0.240 0.255 6 b3 1.14 1.73 0.045 0.068 4 L 13.52 14.02 0.532 0.552 c 0.36 0.61 0.014 0.024 L1 3.32 3.82 0.131 0.150 2 c1 0.36 0.56 0.014 0.022 4 Ø P 3.54 3.91 0.139 0.154 D 14.85 15.35 0.585 0.604 3 Q 2.60 3.00 0.102 0.118 D1 8.38 9.02 0.330 0.355
Notes(1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Lead dimension and finish uncontrolled in L1 (3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Dimension b1, b3, and c1 apply to base metal only (5) Controlling dimensions: inches (6) Thermal pad contour optional within dimensions E, H1, D2, and E1 (7) Outline conforms to JEDEC® TO-220, except D2 Revision: 07-Mar-2022
1Document Number: 96156 For technical questions within your region:
[email protected],
[email protected],
[email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000